Yauw, Oranna: search on Z-Library

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1

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

Lim, Adeline B.Y., Chang, Andrew C.K., Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.95 MB

english, 2014

2

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution

Lim, Adeline B.Y., Boothroyd, Chris B., Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 3.06 MB

english, 2016

3

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Leading edge die stacking and wire bonding technologies for advanced 3D memory packages

Yauw, Oranna, Wu, Jie, Tan, Andrew, Qin, Ivy, Shah, Aashish, Yang, Jeong Ho, Schulze, Gary

Year:

2017

File:

PDF, 3.43 MB

2017

4

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Advanced wire bonding technology for Ag wire

Shah, Aashish, Rockey, Thomas, Xu, Hui, Qin, Ivy, Jie, Wu, Yauw, Oranna, Chylak, Bob

Year:

2015

Language:

english

File:

PDF, 10.01 MB

english, 2015

5

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Study of 0.6mil silver alloy wire in challenging bonding processes

Wu, Jie, Yang, Jeong-Ho, Yauw, Oranna, Qin, Ivy, Rockey, Tom, Chylak, Bob

Year:

2014

Language:

english

File:

PDF, 364 KB

english, 2014

6

[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - Ultra low loop conversion from gold to copper wire

Lee Kuan Fang,, Kwon, OD, Yauw, Oranna, Capistrano, Don, Milton, Basil

Year:

2010

Language:

english

File:

PDF, 548 KB

english, 2010

7

[IEEE 2018 China Semiconductor Technology International Conference (CSTIC) - Shanghai (2018.3.11-2018.3.12)] 2018 China Semiconductor Technology International Conference (CSTIC) - Thin die stacking technologies for 3D memory packages

Wu, Jie, Yauw, Oranna, Tan, Andrew, Clauberg, Horst, Buergi, Daniel

Year:

2018

Language:

english

File:

PDF, 756 KB

english, 2018

8

Evaluation of the corrosion performance of Cu–Al intermetallic compounds and the effect of Pd addition

Lim, Adeline B.Y., Neo, Wei Jian, Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.46 MB

english, 2015

9

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Wire bonding optimization with fine copper wire for volume production

Yauw, Oranna, Clauberg, Horst, Kuan Fang Lee,, Liming Shen,, Chylak, Bob

Year:

2010

Language:

english

File:

PDF, 1.30 MB

english, 2010

10

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Bonding of Ag-alloy wire in LED packages

Jie Wu,, Rockey, Tom, Yauw, Oranna, Liming Shen,, Chylak, Bob

Year:

2012

Language:

english

File:

PDF, 1.37 MB

english, 2012

11

[ECS ISTC/CSTIC 2009 (CISTC) - Shanghai, China (March 19 - March 20, 2009)] ECS Transactions - The Destructive Wire Bond Pull Test Methodology for the Ultra Low Loop Application on Thinner Die Package

Kwon, O Dal, Chylak, Bob, Yauw, Oranna, Lee, Kuan Fang

Year:

2009

Language:

english

File:

PDF, 661 KB

english, 2009

12

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package

Qin, Ivy, Yauw, Oranna, Schulze, Gary, Shah, Aashish, Chylak, Bob, Wong, Nelson

Year:

2017

Language:

english

File:

PDF, 1.85 MB

english, 2017

13

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - High throughput thermo-compression bonding with pre-applied underfill for 3D memory applications

Lim, Adeline B. Y., Rezvani, Alireza, Datinguinoo Bacay, Ryjean, Colosimo, Tom, Yauw, Oranna, Clauberg, Horst, Chylak, Bob

Year:

2016

File:

PDF, 319 KB

2016

14

Reversible Liquid−Liquid Transitions in the Early Stages of Monolayer Self-Assembly

Sung, Myung M., Carraro, Carlo, Yauw, Oranna W., Kim, Yunsoo, Maboudian, Roya

Journal:

Journal of Physical Chemistry B

Year:

2000

Language:

english

File:

PDF, 229 KB

english, 2000

15

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Advances in Memory Die Stacking

Marte, Andreas, Ernst, Urban, Clauberg, Horst, Buergi, Daniel, Chylak, Bob, Wu, Jie, Yauw, Oranna, Friederichs, Ulf, Barthold, Ulrich

Year:

2018

Language:

english

File:

PDF, 908 KB

english, 2018

16

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition

Lim, Adeline B. Y., Neo, Wei Jian, Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong

Year:

2015

Language:

english

File:

PDF, 376 KB

english, 2015

17

Thermal Behavior of Alkyl Monolayers on Silicon Surfaces

Sung, Myung M., Kluth, G. Jonathan, Yauw, Oranna W., Maboudian, Roya

Journal:

Year:

1997

Language:

english

File:

PDF, 158 KB

english, 1997

18

Observation of Three Growth Mechanisms in Self-Assembled Monolayers

Carraro, Carlo, Yauw, Oranna W., Sung, Myung M., Maboudian, Roya

Journal:

Journal of Physical Chemistry B

Year:

1998

Language:

english

File:

PDF, 209 KB

english, 1998

19

[IEEE 2016 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2016.3.13-2016.3.14)] 2016 China Semiconductor Technology International Conference (CSTIC) - Advances in wire bonding to lower package cost and improve capability

Qin, Ivy, Yauw, Oranna, Shah, Aashish, Xu, Hui, Chylak, Bob, Wong, Nelson

Year:

2016

File:

PDF, 4.18 MB

2016

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